Taiwanese chipmaker MediaTek has announced its latest mobile chipset, the MediaTek Dimensity 1050 that comes as the company’s first chipset to offer dual mmWave and sub-6GHz 5G connectivity.
The new chipset comes as a rather toned-down version of the MediaTek Dimensity 1100 chipset. It comes with an eight-core setup that includes six Arm Cortex A55 efficiency cores and two Arm Cortex A78 high performance cores. The chipset comes with an Arm Mali-G71 GPU with MediaTek’s HyperEngine 5.0. The MediaTek Dimensity 1050 chipset is built on a 6nm process and supports a maximum of FHD+ display with 144Hz refresh rate.
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The MediaTek Dimensity 1050 will also enable support for hardware-accelerated AV1 video decoding, HDR10+ playback, and Dolby Vision is also on board. It is the first chipset from MediaTek to support seamless connectivity between mmWave and sub-6Ghz 5G. This also means that OEMs won’t have to choose between supporting either mmWave or sub-6Ghz 5G. Other connectivity features on the MediaTek Dimensity 1050 include support for Bluetooth 5, Wi-Fi 6E with 2×2 MIMO antenna, 4CC/ 3CC carrier aggregration, and more.
For cameras, the MediaTek Dimensity 1050 includes MediaTek Imagiq 760 ISP, and can support up to 108-megapixel primary camera with dual HDR video capture engine. This means that manufacturers can put up to a 108-megapixel primary camera on smartphones that will be powered by a MediaTek Dimensity 1050 chipset.
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Alongside the MediaTek Dimensity 1050, the company has also launched the MediaTek Dimensity 930 chipset, which comes as an upgraded version of Dimensity 810 SoC. The company also launched a new budget chipset, the MediaTek Helio G99, that comes as a successor to the MediaTek Helio G96. The new chipsets will be available to customers in the second quarter of 2022.
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